1st INTERNATIONAL WORKSHOP ON ADVANCED ELECTRONICS PACKAGING
Speakers
Key Speakers
Dr. Ashwath Narayan CN*
Hon'ble Minister of Electronics IT&BT,Minister of Skill Development, Entrepreneurship and Livelihood
Government of Karnataka
Ms. Gunjan Krishna
Commissioner for Industrial Development and Director, Department of Industries & Commerce
Government of Karnataka
Shri. Pradip Prabhakar
Commissioner, Dept of Technical Education
Government of Karnataka
Dr. Seung Wook Yoon, Ph.D
Corporate VP / Package Solution Planning & Strategy
Samsung Electronics Co. , Ltd.
Ms. E Jan Vardaman
Founder & President
TechSearch International, Inc.
Mr. Subi Kengeri
Vice President, AI Systems Solutions
Applied Materials, USA
Prof. Rao Tummala
Director Emeritus
Georgia Tech, USA
Dr. Ravi M. Bhatkal, Ph.D.
Shri Amitesh Kumar Sinha
Joint Secretary
Ministry of Electronics and Information Technology
Mr. Steve Stephenson
Senior Manager, Packaging Design
Micron, USA
Dr. Suraj Rengarajan, Ph.D
India CTO
Applied Materials India
Dr. Ravi Mahajan
Intel Fellow
Intel Corp, USA
Ms. Sunita Verma
R&D Group Coordinator
Ministry of Electronics and Information Technology
Mr. Anand Muthaiah
Director
Tessolve, India
Mr. Yogan Senthilkumar
Vice President, Engineering
Tessolve, India
Mr. Sam Karikalan
VP Conference
Broadcom USA, IEEE-EPS
Dr. Anandaroop Bhattacharya
Associate Professor
IIT, Kharagpur
Dr. Nilesh Badwe
Associate Professor
IIT, Kanpur
Mr. Shanmugaraj
Scientist
Centre for Sensors, Vision Technology and Controls (C-SVTC)
Mr. Krishan Kumar
Scientist/Engineer SF
Ministry of Electronics and Information Technology
Mr. Nandha Mohanraj
Director
Western Digital, India
Mr. Sudarshan Sarma
Head of PCB, Packaging, Simulations and Mechanical Engineering teams
Tessolve Services Pvt Ltd
Mr. Jitendra Chaddah
VP, Country Head India GlobalFoundries
Mr. Chee Ping Lee
Technical Director (Advanced Packaging)
Lam Research
Mr. Vijaykumar C Patil
Application Engineering Group Director
Cadence
Mr. Andrew Goh
Corporate VP and GM
Lam Research, Singapore
Mr. Harsha Adya
Managing Director
Wuerth Elektronik India Pvt ltd
Mr. Pradeep Dixit
Associate Professor
IIT, Mumbai
Mr. Vivek Raghuraman
Director R&D
Broadcom, USA
Mr. Amudhan Balasubramanian
General Manager
HCLTech
Mr. Harjashan Singh
Senior Director, Package Development Engg.
Micron, USA
Mr. Ranjay Laha
DGM, Semiconductor Devices
Bharat Electronics Ltd, Bengaluru
Come Join The Biggest
Advanced Electronics Packaging
Workshop
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