Speakers
Key Speakers

Dr. Ashwath Narayan CN*
Hon'ble Minister of Electronics IT&BT,Minister of Skill Development, Entrepreneurship and Livelihood
Government of Karnataka

Ms. Gunjan Krishna
Commissioner for Industrial Development and Director, Department of Industries & Commerce
Government of Karnataka

Shri. Pradip Prabhakar
Commissioner, Dept of Technical Education
Government of Karnataka

Dr. Seung Wook Yoon, Ph.D
Corporate VP / Package Solution Planning & Strategy
Samsung Electronics Co. , Ltd.

Ms. E Jan Vardaman
Founder & President
TechSearch International, Inc.

Mr. Subi Kengeri
Vice President, AI Systems Solutions
Applied Materials, USA

Prof. Rao Tummala
Director Emeritus
Georgia Tech, USA

Dr. Ravi M. Bhatkal, Ph.D.

Shri Amitesh Kumar Sinha
Joint Secretary
Ministry of Electronics and Information Technology

Mr. Steve Stephenson
Senior Manager, Packaging Design
Micron, USA

Dr. Suraj Rengarajan, Ph.D
India CTO
Applied Materials India

Dr. Ravi Mahajan
Intel Fellow
Intel Corp, USA

Ms. Sunita Verma
R&D Group Coordinator
Ministry of Electronics and Information Technology

Mr. Anand Muthaiah
Director
Tessolve, India

Mr. Yogan Senthilkumar
Vice President, Engineering
Tessolve, India

Mr. Sam Karikalan
VP Conference
Broadcom USA, IEEE-EPS

Dr. Anandaroop Bhattacharya
Associate Professor
IIT, Kharagpur

Dr. Nilesh Badwe
Associate Professor
IIT, Kanpur

Mr. Shanmugaraj
Scientist
Centre for Sensors, Vision Technology and Controls (C-SVTC)

Mr. Krishan Kumar
Scientist/Engineer SF
Ministry of Electronics and Information Technology

Mr. Nandha Mohanraj
Director
Western Digital, India

Mr. Sudarshan Sarma
Head of PCB, Packaging, Simulations and Mechanical Engineering teams
Tessolve Services Pvt Ltd

Mr. Jitendra Chaddah
VP, Country Head India GlobalFoundries

Mr. Chee Ping Lee
Technical Director (Advanced Packaging)
Lam Research

Mr. Vijaykumar C Patil
Application Engineering Group Director
Cadence

Mr. Andrew Goh
Corporate VP and GM
Lam Research, Singapore

Mr. Harsha Adya
Managing Director
Wuerth Elektronik India Pvt ltd

Mr. Pradeep Dixit
Associate Professor
IIT, Mumbai

Mr. Vivek Raghuraman
Director R&D
Broadcom, USA

Mr. Amudhan Balasubramanian
General Manager
HCLTech

Mr. Harjashan Singh
Senior Director, Package Development Engg.
Micron, USA

Mr. Ranjay Laha
DGM, Semiconductor Devices
Bharat Electronics Ltd, Bengaluru
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Advanced Electronics Packaging
Workshop
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