Empowering Innovation, Redefining Semiconductor Packaging and Transforming Semicon Landscape
2023 IEEE-EPS-IESA Workshop on Semiconductor Packaging
About The Event
Explore the forefront of semiconductor innovation with the Semiconductor Packaging Workshop, a collaborative initiative by IESA and IEEE-EPS (USA). This pivotal platform unites stakeholders across government, industry, academia, policymaking, entrepreneurship, and students to foster innovation in semiconductor packaging, focusing on microsystems packaging and manufacturing.
Addressing manufacturing and educational needs, the workshop catalyzes collaborative research discussions. Its success signifies the synergistic efforts of IESA and IEEE-EPS, reflecting a promising future for joint initiatives. This underscores the commitment of the Indian and Karnataka governments to propel ESDM industry growth.
It is a monumental platform within the Electronics & Semicon ecosystem, showcasing IESA's commitment to India's preeminence in Electronics & Semicon.
Learn MoreKey Aspects
Amplifying Innovation
Bridging Gaps
Shaping Futures
Creating Opportunities
Nurturing Semiconductor Potential
Building Tomorrow’s Technology
Event Highlights
25+ Speakers
2023 IEEE-EPS-IESA Workshop on Semiconductor Packaging
Audience: Expecting 200+ | Startups, Industry, Academia, Govt, Researchers
Sessions: 7 Sessions | 20+ Keynotes | 3 Panel Discussions
Focus: Packaging Technologies, Heterogeneous Integration, OSAT/ATMP, Design and Simulation tools, Emerging technologies and materials, Optical technologies, R&D and skilling
Focus Areas
Addressing Manufacturing and Educational Needs
Empowering Designers for Packaging Excellence
Catalyzing Semiconductor Industry Growth
Promoting Collaborative Research in Semiconductors
Focus of IEEE EPS on India Chapter
2023 IEEE-EPS-IESA Workshop on Semiconductor Packaging
Key Speakers
Prof. Rao Tummala
Founding Director & Emeritus Professor at Georgia Institute of Technology
Mr. Raghu Panicker
CEO, Kaynes Semicon
Mr. Sam Karikalan
VP of Conferences - IEEE EPS | Sr. Manager at Broadcom
Mr. Ning Ye
Sr. Director, Western Digital
Mr. Arvind Kumar
Director General, STPI; Chairman STPI NEXT
Mr. Sanjeev Kumar Gupta
Chief Executive Officer, Karnataka Digital Economy Mission (KDEM)
Mr. Abhijeet Agrawal
Managing Director, M.P State Electronics Development Corporation, Department of Science & Technology, GoMP
Mr. Rangesh Raghavan
Corporate Vice President & GM India, Lam Research
Dr. Charan Gurumurthy
Senior Vice President, Tata Electronics
Mr. Sanjay Gupta
Chairman, IESA, President & CEO at Minda Corporation
Mr. Suresh Subramanyam
Founder & CTO, Infinipack
Mr. Manas Ranjan Panda
Special Secretary, E&T Department, Government of Odisha
Mr.Krishnan Kumar
Scientist/Engineer, Semi-Conductor Laboratory
Mr. Gokul Kumar
Sr. Director - Package Development and Engineering, Micron Technology
Mr. Muthukrishnan Chinnasamy
Executive Director Zaikenn Technologies
Mr. Ashok Chandak
President, IESA
Mr. Ignazio Piacentini
Independent Consultant
Mr. Ajit Sequeira
Group Director R&D, Synopsys
Mr. Satya Marni
Director, R&D Physical Design, Synopsys Inc
Ms. Vijaylaxmi Gumaste Khanolkar
Distinguished Member Of Technical Staff, Texas Instruments
Mr. Ravi Bhatkal
Managing Director, India, MacDermid Alpha
Dr. Ashwini Aggarwal
Accolplished Government Affairs/Marketing Professional | Director-GA, Applied Materials / Past Chair, IESA
Dr. Aloknath De
CEO, Cyber-Physical Systems Co
Ms. Kavitha Nagarajan
IC Package Architect | Client Computing Group, Intel Corporation
Mr. Anandaroop Bhattacharya
Professor, Mechanical Engineering, IIT Kharagpur
Mr. Jugal Kishore
System Architect, Lightspeed Photonics
Mr. Kartik Kariya
Sr. Director, Alphawave IP Group
Mr. Nandha Mohanraj
Director, Western Digital, India
Mr. Praveen Kumar
Associate Professor, Dept of Materials Engineering, IISc
Mr. Priyal Shah
Member Of Technical Staff, Advanced Packaging, AMD
Mr. Rajeev Kumar Srivastav
Director, Platform Architect, NXP Semiconductors
Mr. Rajesh Vaddempudi
Sr. Vice President, Test Engineering, Tessolve
Mr. Ravi Mahajan
Fellow, Intel
Mr. Raja Manickam
Founder, AJK NexSemi
Mr. Sachin Patil
Dy. Director Technical Program Management, AI Systems Solutions, Applied Materials
Mr. Santosh Kumar
VP & Head, Semiconductor Manufacturing, Reliance
Mr. Shashank Gupta
Photonics Technical Lead & Manager, Lightmatter
Dr. Shiv Govind Singh
Associate Professor, Dept of EE, IIT Hyderabad
Mr. Shivraj Thakare
Director IP Engineering, Intel Corporation
Mr. Siddhartha Duttagupta
Professor, EE, IIT Bombay
Mr. Sridhar Muthrasanallur
Sr. Principal Engineer and I/O Technologist, Intel Corporation
Mr. Surya Prekke
Vice President of Engineering, Network & Edge Group, Intel India
Mr. Vamsi Krishna Yaddanapudi
Senior Technical Manager, Electronics , Ansys India Ltd.
Mr. Vivek Raghuraman
Co-founder and CEO, Mixxtech
DAY 1 - 30th November 2023
TIME
AGENDA
TITLE
SPEAKERS
Registration & Inauguration Session
08:00 - 09:30
Registration
9:30 - 10:30
Welcome Address
Mr. Ashok Chandak, President, IESA & Mr. Sam Karikalan, VP of Conferences, IEEE-EPS
Address by Chief Guest
Shri. Arvind Kumar , Chairman – STPINEXT & Director General STPI
Address by Guest of Honor
Mr. BV Naidu, Chairman, Karnataka Digital Economy Mission (KDEM)
Address by Guest of Honor
Shri. Abhijeet Agarwal, IAS,MD MPSEDC
Address by Guest of Honor
Mr. Sanjeev Kumar Gupta, CEO, KDEM
Keynote Address
Mr. Raghu Panicker, CEO, Kaynes SemiCon
Vote of Thanks
Mr. Suresh Subramanyam, Founder & CTO , Infinipack
10:30 - 10:50
Inauguration of Booth
10:50 - 11:20
TEA BREAK
Packaging Technologies
11:20 - 11:40
Keynote
Semiconductor Assembly & Test: Competitive Advantage for India.
Dr. Charan Gurumurthy, Senior Vice President, Tata Electronics
11:40 - 12:00
Keynote
Moving Design Landscape From Chip to Package
Mr. Arun Chandrasekar, Senior Principal Engineer, Intel
12:00 - 12:20
Keynote
Evolution of Flash Memory Packaging Solutions
Mr. Nandha Mohanraj, Director, Western Digital
12:20 - 12:40
Keynote
Heterogenous Integration in the AI ERA
Mr. Sachin Patil, Dy. Director Technical Program Management, AI Systems Solutions, Applied Material
12:40 - 14:10
LUNCH BREAK
Heterogeneous Integration with IP/SoC/Chiplet
14:10 - 14:30
Keynote
Universal Chiplet Interconnect Express (UCIe): Building an Open Ecosystem of Chiplets for On-Package Innovations
Mr. Sridhar Muthrasanallur, Sr. Principal Engineer and I/O Technologist, Intel Corporation.
14:30 - 14:50
Keynote
Chiplet Integration Challenges and Considerations
Mr. Sam Karikalan, Sr. Manager, Broadcom
14:50 - 15:10
Keynote
Chiplet Architectures and 3D Heterogeneous Integration
Mr. Priyal Shah, Member of Technical Staff, Advanced Packaging, AMD
15:10 - 16:10
Panel session
Challenges in IP/SoC Design for Heterogeneous Integration
Speakers |
Mr. Shivraj Thakare, Director IP Engineering, Intel Corporation |
Mr. Satya Marni, Director, R&D Physical Design, Synopsys In, Moderator |
Ms. Vijayalaxmi Khanolkar, Distinguished Member Of Technical Staff, Texas Instruments |
Mr. Kartik Kariya, Sr Director, Alphawave IP Group |
Mr. Rajeev Kumar, Director, Platform Architect, NXP Semiconductors |
16:10 - 16:30
TEA BREAK
Emerging Optical Technologies
16:30 - 16:50
Keynote
The Reincarnation of Interconnects in the Chiplet Era
Mr. Shashank Gupta, Technical Leader and Manager, Lightmatter
16:50 - 17:10
Keynote
Advanced Integration of Optical Interconnects
Mr. Vivek Raghuraman, Co-founder and CEO, Mixxtech
17:10 - 17:30
Keynote
Electronic-Photonic Integration on 3D System-in-Package: Architecture and Development
Mr. Jugal Kishore, System Architect, Lightspeed Photonics
17:30 - 17:50
Keynote
Semicon & Photonics Convergence Requires the Scaling up of PIC (Photonics Integrated) Manufacturing
Mr. Ignazio Piacentini, Independent Consultant
EDA / Tools for Heterogeneous Integration
17:50 - 18:50
Keynote
Design and Simulations for Heterogeneous Integration
Mr. Ajit Sequeria, Group Director R&D, Synopsys & Mr. Vamsi Krishna, Senior Technical Manager, Electronics, Ansys India Ltd.
18:50 - 19:20
Networking
19:30 Onwards
Banquet Speech and Cocktails/Dinner
Mr. Veerappan V V, Tessolove & Mr. Ravi Mahajan, Intel
DAY 2 - 01st December 2023
TIME
AGENDA
TITLE
SPEAKER
09:30 - 10:00
Keynote
Packaging by the Numbers
Mr. Raja Manickam, Founder, iVP Semiconductor
Emerging Technologies / Materials
10:00 - 10:20
Keynote
New Frontiers in Flash Products Package Design
Mr. Ning Ye, Sr. Director, Western Digital
10:20 - 10:40
Keynote
Advanced Materials for Semiconductor Packaging and Complex Integrated Systems
Mr. Ravi Bhatkal, MD, India, MacDermid Alpha
10:40 - 11:00
Keynote
Structural Integrity Issues Related to Package Level Interconnects: Materials Science-Informed Mechanics-Driven Approach
Mr. Praveen Kumar, Prof, Dept of Materials Engg, IISc
11:00 - 11:20
TEA BREAK
11:20 - 11:40
Keynote
Low Temperature Low Pressure Wafer to Wafer Cu- Cu Bonding Technologies: A Giants Step Towards 3D-IC Integration
Dr. Shiv Govind Singh, Prof, Dept of EE, IIT Hyderabad
11:40 - 12:00
Keynote
Extending Moore’s Law with Advanced Packaging
Mr. Rangesh Raghavan, Corporate Vice President & GM, India, Lam Research
12:00 - 12:20
Keynote
The New Semiconductor Packaging and Destination
Mr. Manas Ranjan Panda, Special Secretary , E&T Department ,Government of Odisha
12:20 - 12:40
Presentation
IEEE EPS Growth Plans for India
Ms. Kavitha Nagarajan, IC Package Architect, Client Computing Group, Intel Corporation
12:40 - 13:20
LUNCH BREAK
Booth Visits
OSAT / ATMP
13:20 - 13:40
Keynote
India ATMP Manufacturing Workforce Opportunities
Mr. Gokul Kumar, Sr. Director, Micron
13:40 - 14:00
Keynote
Advanced Semiconductor Packaging Overview: Market & Technology Trends
Mr. Santosh Kumar, Vice President and Head of Semiconductor Development & Manufacturing, Reliance
14:00 - 14:20
Keynote
Enabling Volume Testing at OSAT Keeping Test Cost, Yield and Time to Market as Priority.
Mr. Rajesh V, Sr. VP, Tessolve
R&D and Skilling Session
14:20 - 14:40
Keynote
Next Gen, Global-level and Large-Scale Device, Packaging and Systems R&D and Workforce Development in India
Prof. Rao Tummala, Distinguished Chair Prof, Georgia Tech, ISM advisor
14:40 - 15:00
Keynote
Assembly and Packaging Capabilities
Mr. Krishan Kumar, Scientist/Engineer, Semi-Conductor Laboratory
15:00 - 15:20
Keynote
SEMI Electronic Packaging Standards
Dr. Ashwini Aggarwal, Chairman, India Semiconductor Manufacturing Advisory Committee
15:20 - 15:40
Networking
15:40 - 16:40
Panel Session
Speakers |
Mr. Ravi Mahajan, Fellow Intel, Moderator |
Mr. Anandaroop Bhattacharya, Prof, Mech Engg, IITKGP |
Mr. Siddhartha Duttagupta, Prof, EE, IITB |
Mr. Ravi Bhatkal, MD, India, MacDermid Alpha |
Dr. Ashwini Aggarwal, Director, Government Affairs, Applied Materials |
Mr. Gokul Kumar, Sr. Director, Micron |
Dr. Charan Gurumurthy, Senior Vice President, Tata Electronics |
16:40 - 17:00
Closing Remarks, Next Steps, and Future Events' Plans
Mr. Sam Karikalan, Mr. Suresh Subramanyam, Dr. Aloknath De
17:00
High Tea
Networking
DISPERSE – SEE YOU IN 2024
2023 IEEE-EPS-IESA Workshop on Semiconductor Packaging
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2023 IEEE-EPS-IESA Workshop on Semiconductor Packaging
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