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2023 IEEE-EPS-IESA Workshop on Semiconductor Packaging

Venue: The LaLiT Ashok, Bengaluru

Empowering Innovation, Redefining Semiconductor Packaging and Transforming Semicon Landscape

2023 IEEE-EPS-IESA Workshop on Semiconductor Packaging

About The Event

Explore the forefront of semiconductor innovation with the Semiconductor Packaging Workshop, a collaborative initiative by IESA and IEEE-EPS (USA). This pivotal platform unites stakeholders across government, industry, academia, policymaking, entrepreneurship, and students to foster innovation in semiconductor packaging, focusing on microsystems packaging and manufacturing.

Addressing manufacturing and educational needs, the workshop catalyzes collaborative research discussions. Its success signifies the synergistic efforts of IESA and IEEE-EPS, reflecting a promising future for joint initiatives. This underscores the commitment of the Indian and Karnataka governments to propel ESDM industry growth.

It is a monumental platform within the Electronics & Semicon ecosystem, showcasing IESA's commitment to India's preeminence in Electronics & Semicon.

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Key Aspects

Amplifying Innovation

Bridging Gaps

Shaping Futures

Creating Opportunities

Nurturing Semiconductor Potential

Building Tomorrow’s Technology

25+ Speakers
2023 IEEE-EPS-IESA Workshop on Semiconductor Packaging
Audience: Expecting 200+ | Startups, Industry, Academia, Govt, Researchers
Sessions: 7 Sessions | 20+ Keynotes | 3 Panel Discussions
Focus: Packaging Technologies, Heterogeneous Integration, OSAT/ATMP, Design and Simulation tools, Emerging technologies and materials, Optical technologies, R&D and skilling
Addressing Manufacturing and Educational Needs
Empowering Designers for Packaging Excellence
Catalyzing Semiconductor Industry Growth
Promoting Collaborative Research in Semiconductors
Focus of IEEE EPS on India Chapter
2023 IEEE-EPS-IESA Workshop on Semiconductor Packaging

Key Speakers

Prof. Rao Tummala

Founding Director & Emeritus Professor at Georgia Institute of Technology

Mr. Raghu Panicker

CEO, Kaynes Semicon

Mr. Sam Karikalan

VP of Conferences - IEEE EPS | Sr. Manager at Broadcom

Mr. Ning Ye

Sr. Director, Western Digital

Mr. Arvind Kumar

Director General, STPI; Chairman STPI NEXT

Mr. Sanjeev Kumar Gupta

Chief Executive Officer, Karnataka Digital Economy Mission (KDEM)

Mr. Abhijeet Agrawal

Managing Director, M.P State Electronics Development Corporation, Department of Science & Technology, GoMP

Mr. Rangesh Raghavan

Corporate Vice President & GM India, Lam Research

Dr. Charan Gurumurthy

Senior Vice President, Tata Electronics

Mr. Sanjay Gupta

Chairman, IESA, President & CEO at Minda Corporation

Mr. Suresh Subramanyam

Founder & CTO, Infinipack

Mr. Manas Ranjan Panda

Special Secretary, E&T Department, Government of Odisha

Mr.Krishnan Kumar

Scientist/Engineer, Semi-Conductor Laboratory

Mr. Gokul Kumar

Sr. Director - Package Development and Engineering, Micron Technology

Mr. Muthukrishnan Chinnasamy

Executive Director Zaikenn Technologies

Mr. Ashok Chandak

President, IESA

Mr. Ignazio Piacentini

Independent Consultant

Mr. Ajit Sequeira

Group Director R&D, Synopsys

Mr. Satya Marni

Director, R&D Physical Design, Synopsys Inc

Ms. Vijaylaxmi Gumaste Khanolkar

Distinguished Member Of Technical Staff, Texas Instruments

Mr. Ravi Bhatkal

Managing Director, India, MacDermid Alpha

Dr. Ashwini Aggarwal

Accolplished Government Affairs/Marketing Professional | Director-GA, Applied Materials / Past Chair, IESA

Dr. Aloknath De

CEO, Cyber-Physical Systems Co

Ms. Kavitha Nagarajan

IC Package Architect | Client Computing Group, Intel Corporation

Mr. Anandaroop Bhattacharya

Professor, Mechanical Engineering, IIT Kharagpur

Mr. Jugal Kishore

System Architect, Lightspeed Photonics

Mr. Kartik Kariya

Sr. Director, Alphawave IP Group

Mr. Nandha Mohanraj

Director, Western Digital, India

Mr. Praveen Kumar

Associate Professor, Dept of Materials Engineering, IISc

Mr. Priyal Shah

Member Of Technical Staff, Advanced Packaging, AMD

Mr. Rajeev Kumar Srivastav

Director, Platform Architect, NXP Semiconductors

Mr. Rajesh Vaddempudi

Sr. Vice President, Test Engineering, Tessolve

Mr. Ravi Mahajan

Fellow, Intel

Mr. Raja Manickam

Founder, AJK NexSemi

Mr. Sachin Patil

Dy. Director Technical Program Management, AI Systems Solutions, Applied Materials

Mr. Santosh Kumar

VP & Head, Semiconductor Manufacturing, Reliance

Mr. Shashank Gupta

Photonics Technical Lead & Manager, Lightmatter

Dr. Shiv Govind Singh

Associate Professor, Dept of EE, IIT Hyderabad

Mr. Shivraj Thakare

Director IP Engineering, Intel Corporation

Mr. Siddhartha Duttagupta

Professor, EE, IIT Bombay

Mr. Sridhar Muthrasanallur

Sr. Principal Engineer and I/O Technologist, Intel Corporation

Mr. Surya Prekke

Vice President of Engineering, Network & Edge Group, Intel India

Mr. Vamsi Krishna Yaddanapudi

Senior Technical Manager, Electronics , Ansys India Ltd.

Mr. Vivek Raghuraman

Co-founder and CEO, Mixxtech

2023 IEEE-EPS-IESA Workshop on Semiconductor Packaging


DAY 1 - 30th November 2023





Registration & Inauguration Session

08:00 - 09:30
9:30 - 10:30
Welcome Address
Mr. Ashok Chandak, President, IESA & Mr. Sam Karikalan, VP of Conferences, IEEE-EPS
Address by Chief Guest
Shri. Arvind Kumar , Chairman – STPINEXT & Director General STPI
Address by Guest of Honor
Mr. BV Naidu, Chairman, Karnataka Digital Economy Mission (KDEM)
Address by Guest of Honor
Shri. Abhijeet Agarwal, IAS,MD MPSEDC
Address by Guest of Honor
Mr. Sanjeev Kumar Gupta, CEO, KDEM
Keynote Address
Mr. Raghu Panicker, CEO, Kaynes SemiCon
Vote of Thanks
Mr. Suresh Subramanyam, Founder & CTO , Infinipack
10:30 - 10:50
Inauguration of Booth
10:50 - 11:20

Packaging Technologies

11:20 - 11:40
Semiconductor Assembly & Test: Competitive Advantage for India.
Dr. Charan Gurumurthy, Senior Vice President, Tata Electronics
11:40 - 12:00
Moving Design Landscape From Chip to Package
Mr. Arun Chandrasekar, Senior Principal Engineer, Intel
12:00 - 12:20
Evolution of Flash Memory Packaging Solutions
Mr. Nandha Mohanraj, Director, Western Digital
12:20 - 12:40
Heterogenous Integration in the AI ERA
Mr. Sachin Patil, Dy. Director Technical Program Management, AI Systems Solutions, Applied Material
12:40 - 14:10

Heterogeneous Integration with IP/SoC/Chiplet

14:10 - 14:30
Universal Chiplet Interconnect Express (UCIe): Building an Open Ecosystem of Chiplets for On-Package Innovations
Mr. Sridhar Muthrasanallur, Sr. Principal Engineer and I/O Technologist, Intel Corporation.
14:30 - 14:50
Chiplet Integration Challenges and Considerations
Mr. Sam Karikalan, Sr. Manager, Broadcom
14:50 - 15:10
Chiplet Architectures and 3D Heterogeneous Integration
Mr. Priyal Shah, Member of Technical Staff, Advanced Packaging, AMD
15:10 - 16:10
Panel session
Challenges in IP/SoC Design for Heterogeneous Integration
Mr. Shivraj Thakare, Director IP Engineering, Intel Corporation
Mr. Satya Marni, Director, R&D Physical Design, Synopsys In, Moderator
Ms. Vijayalaxmi Khanolkar, Distinguished Member Of Technical Staff,  Texas Instruments
Mr. Kartik Kariya, Sr Director, Alphawave IP Group
Mr. Rajeev Kumar, Director, Platform Architect,  NXP Semiconductors
16:10 - 16:30

Emerging Optical Technologies

16:30 - 16:50
The Reincarnation of Interconnects in the Chiplet Era
Mr. Shashank Gupta, Technical Leader and Manager, Lightmatter
16:50 - 17:10
Advanced Integration of Optical Interconnects
Mr. Vivek Raghuraman, Co-founder and CEO, Mixxtech
17:10 - 17:30
Electronic-Photonic Integration on 3D System-in-Package: Architecture and Development
Mr. Jugal Kishore, System Architect, Lightspeed Photonics
17:30 - 17:50
Semicon & Photonics Convergence Requires the Scaling up of PIC (Photonics Integrated) Manufacturing
Mr. Ignazio Piacentini, Independent Consultant

EDA / Tools for Heterogeneous Integration

17:50 - 18:50
Design and Simulations for Heterogeneous Integration
Mr. Ajit Sequeria, Group Director R&D, Synopsys & Mr. Vamsi Krishna, Senior Technical Manager, Electronics, Ansys India Ltd.
18:50 - 19:20
19:30 Onwards
Banquet Speech and Cocktails/Dinner
Mr. Veerappan V V, Tessolove & Mr. Ravi Mahajan, Intel

DAY 2 - 01st December 2023





09:30 - 10:00
Packaging by the Numbers
Mr. Raja Manickam, Founder, iVP Semiconductor

Emerging Technologies / Materials

10:00 - 10:20
New Frontiers in Flash Products Package Design
Mr. Ning Ye, Sr. Director, Western Digital
10:20 - 10:40
Advanced Materials for Semiconductor Packaging and Complex Integrated Systems
Mr. Ravi Bhatkal, MD, India, MacDermid Alpha
10:40 - 11:00
Structural Integrity Issues Related to Package Level Interconnects: Materials Science-Informed Mechanics-Driven Approach
Mr. Praveen Kumar, Prof, Dept of Materials Engg, IISc
11:00 - 11:20
11:20 - 11:40
Low Temperature Low Pressure Wafer to Wafer Cu- Cu Bonding Technologies: A Giants Step Towards 3D-IC Integration
Dr. Shiv Govind Singh, Prof, Dept of EE, IIT Hyderabad
11:40 - 12:00
Extending Moore’s Law with Advanced Packaging
Mr. Rangesh Raghavan, Corporate Vice President & GM, India, Lam Research
12:00 - 12:20
The New Semiconductor Packaging and Destination
Mr. Manas Ranjan Panda, Special Secretary , E&T Department ,Government of Odisha
12:20 - 12:40
IEEE EPS Growth Plans for India
Ms. Kavitha Nagarajan, IC Package Architect, Client Computing Group, Intel Corporation
12:40 - 13:20
Booth Visits


13:20 - 13:40
India ATMP Manufacturing Workforce Opportunities
Mr. Gokul Kumar, Sr. Director, Micron
13:40 - 14:00
Advanced Semiconductor Packaging Overview: Market & Technology Trends
Mr. Santosh Kumar, Vice President and Head of Semiconductor Development & Manufacturing, Reliance
14:00 - 14:20
Enabling Volume Testing at OSAT Keeping Test Cost, Yield and Time to Market as Priority.
Mr. Rajesh V, Sr. VP, Tessolve

R&D and Skilling Session

14:20 - 14:40
Next Gen, Global-level and Large-Scale Device, Packaging and Systems R&D and Workforce Development in India
Prof. Rao Tummala, Distinguished Chair Prof, Georgia Tech, ISM advisor
14:40 - 15:00
Assembly and Packaging Capabilities
Mr. Krishan Kumar, Scientist/Engineer, Semi-Conductor Laboratory
15:00 - 15:20
SEMI Electronic Packaging Standards
Dr. Ashwini Aggarwal, Chairman, India Semiconductor Manufacturing Advisory Committee
15:20 - 15:40
15:40 - 16:40
Panel Session
Mr. Ravi Mahajan, Fellow Intel, Moderator
Mr. Anandaroop Bhattacharya, Prof, Mech Engg, IITKGP
Mr. Siddhartha Duttagupta, Prof, EE, IITB
Mr. Ravi Bhatkal, MD, India, MacDermid Alpha
Dr. Ashwini Aggarwal, Director, Government Affairs, Applied Materials
Mr. Gokul Kumar, Sr. Director, Micron
Dr. Charan Gurumurthy, Senior Vice President, Tata Electronics
16:40 - 17:00
Closing Remarks, Next Steps, and Future Events' Plans
Mr. Sam Karikalan, Mr. Suresh Subramanyam, Dr. Aloknath De
High Tea
2023 IEEE-EPS-IESA Workshop on Semiconductor Packaging

Workshop Registration Pricing

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8,000+ GST
2,500+ GST

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2023 IEEE-EPS-IESA Workshop on Semiconductor Packaging

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2023 IEEE-EPS-IESA Workshop on Semiconductor Packaging

Our Committee Members

Executive Chair

Mr. Sam Karikalan


Krishna Moorthy K


Prof. Rao Tummala