2022 Home - Workshop on Semiconductor Packaging

1^st INTERNATIONAL WORKSHOP ON ADVANCED ELECTRONICS PACKAGING

Creating Leadership in Advanced
Semiconductor Packaging Technology
Development & Manufacturing in India

IEEE-Electronics Packaging Society (EPS) and India Electronics Semiconductor Association (IESA) invite you to join 1^st workshop on Advanced Semiconductor Packaging in India on 1^st and 2^nd December 2022 at Bengaluru. Objectives of this workshop are to share overview, current status, challenges, importance of advanced packaging, provide GOI policy overview and progress to develop ecosystem, highlight opportunities and needs for ecosystem development and strategize for educational program and workforce skill development.

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1^st INTERNATIONAL WORKSHOP ON ADVANCED ELECTRONICS PACKAGING

Speakers

Dr. Ashwath Narayan CN*

Hon'ble Minister of Electronics IT&BT,Minister of Skill Development, Entrepreneurship and Livelihood
Government of Karnataka

Ms. Gunjan Krishna

Commissioner for Industrial Development and Director, Department of Industries & Commerce
Government of Karnataka

Shri. Pradip Prabhakar

Commissioner, Dept of Technical Education
Government of Karnataka

Dr. Seung Wook Yoon, Ph.D

Corporate VP / Package Solution Planning & Strategy
Samsung Electronics Co. , Ltd.

Ms. E Jan Vardaman

Founder & President
TechSearch International, Inc.

Mr. Subi Kengeri

Vice President, AI Systems Solutions
Applied Materials, USA

Prof. Rao Tummala

Director Emeritus
Georgia Tech, USA

Dr. Ravi M. Bhatkal, Ph.D.

Managing Director, India

Element Solutions, Inc.

Cookson India Private Limited

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What to expect?

This workshop will act as the platform for reputed global and local researchers, academia members, industry members, and students to discuss, learn, contribute, and interact about the newer developments in semiconductor and systems packaging.

The best global minds on Electronics Packaging meet here

Buoyed from the great strides in Electronics & Semiconductor design and good progress in test, as India embarks big on manufacturing, this workshop brings leaders from industry, academia, and government under one roof for engaging discussions on the next element of the ESDM value chain namely electronics packaging . IEEE EPS and IESA joins hands to bring this workshop to the tech capital of India - Bengaluru on December 1^st & 2^nd, 2022.

1^st INTERNATIONAL WORKSHOP ON ADVANCED ELECTRONICS PACKAGING

Agenda

DAY 1

DAY 2

All the events will be in Indian Standard Time (IST)
* - Awaiting confirmation

Day 1 - 01 December 2022

Day 1: Registration & Inauguration Session

Registration

08:00AM - 09:30AM IST

Inauguration

09:30AM - 10:30AM (IST)

Welcome Address : Mr. K Krishna Moorthy - CEO, IESA & Mr. Sam Karikalan-Sr. Manager, Package Engineering, Broadcom USA & Vice President Conferences IEEE-EPS
Inauguration by:
Dr. C N Ashwath Narayan, Hon'ble Minister for Skill Development, Electronics, IT/BT & Livelihood, Govt. of Karnataka.
Dr. E V Ramana Reddy/Ms. Gunjan Krishna, Add'l Chief Secretary, Govt. of Karnataka.

Day 1: Technology Session

Keynote: Heterogeneous Integration in the AI Era

10:30AM - 10:50AM (IST)

Mr. Subi Kengeri - Vice President, Applied Materials, USA

Keynote: Vision for a globally-competitive Indian Electronics and Semiconductors

10:50AM - 11:20AM (IST)

Prof. Rao Tummala - Professor & Director Emeritus, PRC, GA Tech USA

Coffee/Tea Break- 11:20AM- 11:40AM IST

Keynote:Advanced Package FAB Solutions (APFS) for Chiplet Integration

11:40AM- 12:00PM (IST)

Dr.Seung Wook Yoon- Corporate VP & Head of Packaging Solutions, Samsung Electronics, South Korea.

Keynote: Leading Methodologies Provide the Foundational Building Blocks Across the Industry for the Continued Growth and Expansion Over the Next Decade

12:00PM - 12:20PM (IST)

Mr. Harjashan Singh - Senior Director, Package Development Engineering, Micron, USA

Keynote: The Value of Packaging and Heterogeneous Integration

12:20PM - 12:50PM (IST)

Dr. Ravi Mahajan - Intel Fellow-USA

Lunch Break -12:50 PM - 01:45 PM (IST)

Keynote: How to develop a sustainable interdisciplinary R&D Initiatives in packaging

01:45PM - 02:05PM (IST)

Prof. Srinivasan Raghavan - Director CenSE, IISC

Panel Session : Ecosystem needs for manufacturing collaboration with global entities

02:05PM - 03:05PM (IST)

Moderator: Dr. Suraj Rengarajan - CTO, Applied Materials-India
Dr. Ravi Bhatkal - Managing Director, India Element Solutions, Inc. & Cookson India Private
Mr. Steve Stephenson - Senior Manager, Package Design, Micron, USA.
Ms. Prashasti Rohatgi- Investment Specialist,Invest India

Keynote:Advancements in Package design and need for Package Qualification

03:05PM - 03:25PM (IST)

Mr.Amudhan Balasubramanian -General Manager,HCLTech

Panel Session: Emerging Educational and Research Programs in India (Academia - IISc, IIT-5, GaTech)

03:25PM - 04:25PM (IST)

Moderator: Prof. Rao Tummala - Distinguished Prof. and Director Emeritus, PRC, Ga Tech USA
Dr. Anandaroop Bhattacharya - Associate Professor, Mechanical Engineering, IIT Kharaghpur
Dr. Siva Vanjari - Professor, Electrical engineering and engineering science, IIT Hyderabad
Dr. Nilesh Badwe - Assistant Professor, Dept. of MSE, IIT Kanpur
Prof. Pradeep Dixit - Associate Professor, ME Department, IIT Bombay
Dr. Bijoy K Das - Professor, Dept of Electrical Engineering, IIT Madras
Dr. Prosenjit Sen- Assistant Professor, Dept. of Materials Engineering, IISc

Coffee/Tea Break 4:25PM - 5:00 PM (IST)

Day 1: India Opportunities Session

Panel Session: Opportunities and Needs for ATMP in India - The India perspective

05:00PM - 06:00PM (IST)

Moderator: Mr. Suresh Subramanyam - Sr. Director, Advanced Packaging, Intel India
Mr. Harsha Adya - Managing Director, Wuerth Electronik, India
Mr. Yogan Senthilkumar - Vice President, Engineering, Tessolve, India
Mr. Sam Karikalan- Sr. Manager, Package Engineering, Broadcom USA & Vice President Conferences IEEE-EPS

Keynote: PCB Techology Trends and Opportunities for India

06:00M - 06:20PM (IST)

Mr. Harsha Adya - Managing Director, Wuerth Electronik, India

Break : 06:20 PM-07:00 PM (IST)

Day 1: Banquet Session

Banquet Speech: IEEE EPS - Bringing Together the World's Best in Electronics Packaging Technologies

07:00PM - 07:20PM (IST)

Mr. Sam Karikalan - Sr. Manager, Package Engineering, Broadcom USA & Vice President Conferences IEEE-EPS

Keynote: Driving Packaging Volumes and Market Segments: Where Can India Focus in Near Term?

07:20PM - 07:40PM (IST)

Ms. Jan Vardaman, President, TechSearch International

IESA OVERVIEW

07:40PM - 07:50PM (IST)

Mr. K Krishna Moorthy - CEO, IESA

Cocktail & Dinner - 07:50 PM onwards

Day 2 - 02 December 2022

Day 2: EPS Knowledge Sharing & Strategy Session

Videos of Packaging - Substrate Fab and Assembly processes

09:15AM - 09:30AM (IST)

Mr. Harsha - Scientist, CMTI, Bangalore

Keynote: 3D IC is the new system

09:30AM - 09:50AM (IST)
Mr. Vijayakumar C Patil - Group Director, Cadence Inc.

Keynote: ISM -The Semiconductor Fab & Packaging in India - How critical it is ?

09:50AM - 10:10AM (IST)
Mr. Amitesh Kumar Sinha - Joint Secretary, MeitY & Officiating CEO, ISM

Keynote: Co-Packaging of Silicon Photonics based Optical Interconnects

10:10AM - 10:30AM (IST)
Mr. Vivek Raghuraman - Director R&D Broadcom, USA

Keynote:
1) Advances in package design
2) Test/Mfg challenges with advanced Package design.

10:30AM - 11:00AM (IST)
1) Mr. Sudharshan Sarma- Senior Director - PCB, Packaging, Simulations and Mechanical Engineering , Tessolve Semiconductor Private Ltd
2) Mr. Anand Muthaiah- Vice President , Tessolve Semiconductor Private Ltd

Coffee/Tea Break: 11:00 AM to 11:20 AM (IST)

Keynote: Thermal Management Challenges and Technology Development - A focus on alternative Air movers

11:20AM - 11:40AM (IST)
Dr. Anandaroop Bhattacharya - Associate Professor, Mechanical Engineering, IIT Kharaghpur

Keynote: Enabling Heterogeneous Integration with Innovative Equipment Solutions

11:40AM - 12:00PM (IST)
Mr. CheePing Lee, Technical Director of Advanced Packaging, Lam Research Singapore

Keynote: EMS Companies and their role in system level packaging

12:00PM - 12:20PM (IST)
DS Suhas-Director, SLN Technologies

Keynote : EPS - What does India need strategically in chip level & system level packaging

12:20PM - 12:40PM (IST)
Mr. Andrew GOH - Corporate Vice President & General Manager, Lam Reasearch Singapore CEO, India Semiconductor Mission.

Lunch Break- 12:40PM -01:40 PM (IST)

Keynote: Stratregic Electronics- Defense & Space - special packaging needs

01:40PM - 02:00PM (IST)
Mr. Ranjay Laha-DGM,Semiconductor Devices, Bharat Electronics Limited, Bengaluru

Keynote: The ATMP/OSAT in India - Govt of India skilling palns for capacity creation

02:00PM - 02:20PM (IST)
Ms. Sunita Verma - Chief R&D Coordinator,MeitY

Panel Session: Manufacturing Workforce Training and Education

02:20PM - 03:20PM (IST)
Moderator: Mr. K Krishna Moorthy - CEO and President ,IESA
Mr. Shanmugaraj - Sc F, CMTI, India
Mr. Krishan Kumar - Head of VLSI Assy and Hi-Rel, SCL, India
Dr. Jay Shah-Deputy Director, Global Foundries
Mr. Nandha - Director, Packaging, Western Digital, India
Shri. Pradip Prabhakar,Commissioner, Dept of Technical Education, Government of Karnataka

A presentation about Tutorials Roadmap for India

03:20PM - 03:50PM (IST)
Prof. Rao Tummala, Professor & Director Emeritus, PRC, GA Tech USA

Closing remarks, next steps and future events/plans

03:50PM - 04:10PM (IST)
Krishna/Sam/Suresh

High Tea at 04:10PM - See you in 2023

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1^st INTERNATIONAL WORKSHOP ON ADVANCED ELECTRONICS PACKAGING
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